Chin-Kun Lo

Title: Innovations of Chin-Kun Lo

Introduction

Chin-Kun Lo is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of technology, particularly in the area of semiconductor manufacturing. With a total of 2 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of Chin-Kun Lo's latest patents is titled "Metal bump with an insulating sidewall and method of fabricating thereof." This invention provides metal bumps for connecting a nonconducting substrate and a chip without lateral shorting. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be covered with an insulating layer, while a second predetermined portion of the sidewall of the second bump is also covered with an insulating layer.

Career Highlights

Chin-Kun Lo is currently associated with AU Optronics Corporation, a leading company in the display technology sector. His work at AU Optronics has allowed him to further develop his innovative ideas and contribute to advancements in the field.

Collaborations

Chin-Kun Lo has collaborated with several talented individuals, including Ming-Yi Lay and Yong-Fen Hsieh. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chin-Kun Lo's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative work continues to shape the future of technology.