The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Sep. 08, 2003
Ming-yi Lay, Hsinchu, TW;
Yong-fen Hsieh, Hsinchu Hsien, TW;
Shang-kung Tsai, Kaohsiung, TW;
Chin-kun Lo, Hsinchu Hsien, TW;
Ming-Yi Lay, Hsinchu, TW;
Yong-Fen Hsieh, Hsinchu Hsien, TW;
Shang-Kung Tsai, Kaohsiung, TW;
Chin-Kun Lo, Hsinchu Hsien, TW;
AU Optronics Corp., Hsinchu, TW;
Abstract
Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile