This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Chin-Kun Lan: Innovator in Tungsten Chemical-Mechanical Polishing
Introduction
Chin-Kun Lan is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing, particularly in the improvement of tungsten polishing processes. His innovative approach has led to the development of a patented method that enhances the efficiency and effectiveness of tungsten chemical-mechanical polishing.
Latest Patents
Chin-Kun Lan holds a patent for a "Method for improvement of tungsten chemical-mechanical polishing process." This multi-step method involves several key stages. Initially, a wafer is placed on a first pad of a CMP system, where a head secures the wafer. The head then rotates, polishing the wafer with a tungsten slurry. Subsequently, the wafer is transferred to a second pad, where it undergoes a similar polishing process. After polishing, the wafer is cleaned on the second pad using de-ionized water. The process continues with the wafer being moved to a third pad for further cleaning and polishing, utilizing an oxide slurry with an opposite pH value compared to the tungsten slurry. This innovative method streamlines the tungsten CMP process, enhancing its overall performance.
Career Highlights
Chin-Kun Lan is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor manufacturing.
Collaborations
Chin-Kun Lan has collaborated with notable colleagues, including Ying-Lang Wang and Hui-Ling Wang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Chin-Kun Lan's contributions to the field of tungsten chemical-mechanical polishing exemplify the impact of innovation in semiconductor manufacturing. His patented method not only improves the polishing process but also showcases the importance of collaboration in driving technological advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile