This inventor holds 2 USPTO granted patents. Top assignee: Harvatek Corporation. Active years: 2023-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023-2025
Title: Innovations by Chin-Jui Liang
Introduction
Chin-Jui Liang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. With a focus on packaging methods and heat dissipation efficiency, Liang has been instrumental in advancing the capabilities of semiconductor devices.
Latest Patents
Liang holds 2 patents that showcase his innovative approach. His first patent is a packaging method and package structure. This method involves several steps, including the arrangement of chips on a carrying board for redistribution. Each chip is designed with a first side connected to the board and a second side featuring at least one chip connecting member. The process culminates in applying an encapsulating material to create a unitary structure under specific hot pressing conditions.
His second patent focuses on a semiconductor device with high heat dissipation efficiency. This device includes a base structure, a semiconductor chip, a heat dissipating structure, and a package body. The heat dissipating structure features a buffer layer and a first heat spreader, ensuring effective thermal management. The package body encloses the semiconductor chip and the heat dissipating structure, maintaining compatibility in heat curing temperature.
Career Highlights
Chin-Jui Liang is currently employed at Harvatek Corporation, where he continues to innovate in semiconductor technology. His work has contributed to the development of more efficient and reliable semiconductor devices.
Collaborations
Liang collaborates with talented coworkers, including Hui-Yen Huang and Ping-Lung Wang. Their combined expertise fosters a creative environment that drives innovation.
Conclusion
Chin-Jui Liang's contributions to semiconductor technology through his patents and work at Harvatek Corporation highlight his role as a leading inventor in the field. His innovative packaging methods and heat dissipation solutions are paving the way for advancements in semiconductor devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile