Harvatek Corporation

Chin-Jui Liang

Hui-Yen Huang

Ping-Lung Wang

A packaging method and a package structure are provided. The packaging method includes the following steps. Firstly, a plurality of chips are disposed on a carrying surface of a carrying board for chip redistribution. Each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is provided with at least one chip connecting member. Next, a base structure is provided. The base structure has a bonding surface provided with a plurality of predetermined areas for bonding the chips respectively, and each of the predetermined regions has at least one electrically connecting structure formed therein. Lastly, an encapsulating material is applied to integrate the base structure, the chips, and the carrying board into a unitary structure under specific hot pressing conditions.

Packaging method and package structure

A semiconductor device with high heat dissipation efficiency includes a base structure, a semiconductor chip, a heat dissipating structure, and a package body. The semiconductor chip is disposed on the base structure and has a first surface distant from the base structure. The heat dissipating structure includes a buffer layer and a first heat spreader. The buffer layer is disposed on the first surface of the semiconductor chip and a coverage rate thereof on the first surface is at least 10%. The first heat spreader is disposed on the buffer layer and bonded to the first surface of the semiconductor chip through the buffer layer. The package body encloses the semiconductor chip and the heat dissipating structure, and the package body and the buffer layer have the same heat curing temperature.

Growing community of inventors

Hsinchu, Taiwan

Chin-Jui Liang