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For the Inventor, By the Inventor

Taipei, Taiwan

Chin-Hsien Chang

This inventor holds 8 USPTO granted patents. Top assignee: Compal Electronics, Inc.. Active years: 2010-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Hsien Chang. Retrieved from https://idiyas.com/inventor/chin-hsien-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 87.5

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal8 out of 1,003 
 
Compal Electronics, Inc.
 patents

Years Active: 2010-2022

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8 patents (USPTO):Explore Patents
1. 11513564 - Casing structure and manufacturing method thereof (2022-11-29),
2. 11448294 - Linkage mechanism (2022-09-20),
3. 10963021 - Electronic device and assembling method of electronic device (2021-03-30),
4. 10936028 - Electronic device having a deformation sensor on a fan module of a fan and using a controller to monitor the deformation sensor and control operation of the fan based on a deformation signal of the sensor (2021-03-02),
5. 10915150 - Linkage mechanism and electronic device (2021-02-09),
6. 10631445 - Electronic assembly with RFI shielding (2020-04-21),
7. 8169564 - Display module (2012-05-01),
8. 7704085 - Cover module of electronic device and control method thereof (2010-04-27),

Title: The Innovative Contributions of Chin-Hsien Chang

Introduction

Chin-Hsien Chang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, holding a total of 8 patents. His work primarily focuses on innovative casing structures and mechanisms that enhance functionality and efficiency.

Latest Patents

One of his latest patents is a casing structure and manufacturing method thereof. This invention includes a plastic casing, at least one metal component, and a conductive layer. The design ensures that the metal component is securely disposed on the plastic casing, with at least one side surface covered by the plastic. The conductive layer is strategically placed on the metal component and extends to the plastic casing, providing enhanced durability and performance.

Another notable patent is a linkage mechanism that comprises a pivoting assembly, a cam, a sliding assembly, and at least one linkage. The cam pivots coaxially with the rotating axis of the pivoting assembly, allowing for smooth operation. A leaning element is positioned on one side of the cam, while a sliding frame pivots the leaning element and features at least one limiting area. This innovative mechanism allows for efficient movement and thrust in multiple directions, showcasing Chin-Hsien Chang's ingenuity.

Career Highlights

Chin-Hsien Chang is currently employed at Compal Electronics, Inc., where he continues to develop cutting-edge technologies. His work has significantly impacted the electronics industry, contributing to advancements in product design and functionality.

Collaborations

Chin-Hsien Chang has collaborated with notable coworkers, including Chih-Hsueh Tsai and Yen-Chia Chang. Their combined expertise fosters a creative environment that drives innovation and leads to successful patent applications.

Conclusion

Chin-Hsien Chang's contributions to technology through his patents and collaborative efforts highlight his role as a leading inventor in the field. His innovative designs and mechanisms continue to influence the industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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