The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Mar. 02, 2020
Applicant:
Chin-hsien Chang, Taipei, TW;
Inventor:
Chin-Hsien Chang, Taipei, TW;
Assignee:
COMPAL ELECTRONICS, INC., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/16 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); B29C 45/14336 (2013.01); B29C 45/14467 (2013.01); B29K 2705/00 (2013.01); B29L 2031/3481 (2013.01);
Abstract
A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.
Chang, Chin-Hsien. (2022). Casing structure and manufacturing method thereof (U.S. Patent No. 11513564). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11513564
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile