Chin-Chung Chang

Title: Chin-Chung Chang: Innovator in Circuit Board Technology

Introduction

Chin-Chung Chang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology, particularly through his innovative methods for forming micro-vias. His work has implications for the fabrication and design of circuit layouts, which are essential in modern electronics.

Latest Patents

Chin-Chung Chang holds a patent for a "Method of forming micro-via." This method involves several steps, including the formation of a patterned conductive wiring layer on a substrate, plating a copper layer onto the substrate and the conductive wiring layer, and creating a photoresist layer. The process continues with the removal of part of the photoresist layer to expose the copper layer, followed by the formation of a conductive pillar using the copper layer as a seed layer. The method concludes with the formation of an insulation layer and a patterned conductive wiring layer on the conductive pillar. This innovative approach enhances the efficiency and effectiveness of circuit board manufacturing.

Career Highlights

Chin-Chung Chang is associated with World Wiser Electrics Inc., where he applies his expertise in circuit board technology. His work has been instrumental in advancing the company's capabilities in electronic manufacturing.

Collaborations

Chin-Chung Chang has collaborated with notable colleagues, including Jao-Chin Cheng and Chang-Chin Hsieh. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Chin-Chung Chang's contributions to the field of circuit board technology through his patent for forming micro-vias exemplify his innovative spirit and dedication to advancing electronic manufacturing. His work continues to influence the industry and pave the way for future advancements.