Chin-Chih Hsiao

Title: Innovations by Chin-Chih Hsiao

Introduction

Chin-Chih Hsiao is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of packaging substrates, holding a total of 2 patents. His work focuses on innovative methods for fabricating packaging substrates that enhance the integrity and functionality of electronic components.

Latest Patents

Chin-Chih Hsiao's latest patents include a "Fabrication method of packaging substrate." This method involves providing a carrier with a first metal layer and a second metal layer formed on the first metal layer. It also includes forming a first circuit layer on the second metal layer and a separating portion on the edge of the second metal layer, ensuring that the separating portion is spaced from the first circuit layer. The process continues with the formation of a dielectric layer on both the second metal layer and the first circuit layer, embedding the first circuit layer and the separating portion within the dielectric layer. Finally, forces are applied to the separating portion to remove the first metal layer and the carrier, maintaining the integrity of the first circuit layer.

Another patent is titled "Packaging substrate and fabrication method thereof." This patent outlines a similar process for fabricating a packaging substrate, emphasizing the importance of maintaining the integrity of the first circuit layer throughout the fabrication process.

Career Highlights

Chin-Chih Hsiao is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative techniques in the field of packaging substrates. His contributions have been instrumental in advancing the technology used in electronic packaging.

Collaborations

Chin-Chih Hsiao has collaborated with notable coworkers, including Cheng-Wen Chiu and Wei-Ping Wang. Their combined expertise has fostered a productive environment for innovation and development in their field.

Conclusion

Chin-Chih Hsiao's contributions to the field of packaging substrates through his innovative patents demonstrate his commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.