Chikara Iwata

Title: Chikara Iwata: Innovator in Bump Shape Measurement Technology

Introduction

Chikara Iwata is a notable inventor based in Sagamihara, Japan. He has made significant contributions to the field of measurement technology, particularly in the area of bump shape measurement. His innovative approach has led to the development of a unique patent that enhances the accuracy and efficiency of measuring bumps on various surfaces.

Latest Patents

Chikara Iwata holds a patent for a "Method and apparatus for measuring shape of bumps." This invention provides a bump shape measuring apparatus that includes an illumination optical system designed to illuminate bumps arranged on a board with light at a low tilt angle. The detection optical system captures reflected light from the bumps, allowing for the detection of image signals at a high tilt angle. An image processing unit calculates the outline of the tip and base of each bump, determining geometric characteristics such as position and height. The main control unit displays this information on a display unit, making it a valuable tool for precise measurements.

Career Highlights

Iwata is associated with Hitachi Via Mechanics Ltd., where he has been instrumental in advancing measurement technologies. His work has not only contributed to the company's reputation but has also pushed the boundaries of what is possible in the field of optical measurement.

Collaborations

Chikara Iwata has collaborated with notable colleagues, including Hideaki Sasazawa and Mineo Nomoto. These partnerships have fostered an environment of innovation and have led to the successful development of advanced measurement solutions.

Conclusion

Chikara Iwata's contributions to the field of bump shape measurement technology exemplify the impact of innovative thinking in engineering. His patent and collaborative efforts continue to influence the industry positively.