The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Oct. 15, 2004
Hideaki Sasazawa, Yokohama, JP;
Mineo Nomoto, Yokohama, JP;
Masatoshi Yamaga, Atsugi, JP;
Chikara Iwata, Sagamihara, JP;
Masashi Uehara, Zama, JP;
Hideaki Sasazawa, Yokohama, JP;
Mineo Nomoto, Yokohama, JP;
Masatoshi Yamaga, Atsugi, JP;
Chikara Iwata, Sagamihara, JP;
Masashi Uehara, Zama, JP;
Hitachi Via Mechanics, Ltd., Ebina-Shi, JP;
Abstract
The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.