Location History:
- Hsinchu County, TW (2021)
- Hukou Township, Hsinchu County, TW (2022)
- Hukou Township, TW (2023)
Company Filing History:
Years Active: 2021-2023
Title: Chih-Yen Su: Innovator in Semiconductor Packaging
Introduction
Chih-Yen Su is a prominent inventor based in Hukou, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology. His work focuses on enhancing the reliability and performance of semiconductor devices.
Latest Patents
Chih-Yen Su's latest patents include a novel semiconductor package design. This design features a substrate with a dielectric layer, a copper wiring layer, and a solder resist layer. The unique aspect of this package is the annular opening that surrounds the chip area, which helps reduce concentration stress and prevents cracks during thermal-cycle tests. Another notable patent is the bump structure of the semiconductor package. This structure incorporates an under bump metallurgy (UBM), a first dielectric layer, and a metal bump. The first buffer layer in this design effectively absorbs thermal stress, minimizing the risk of cracks after the bonding process.
Career Highlights
Chih-Yen Su is currently employed at Powertech Technology Inc., where he continues to develop innovative solutions in semiconductor technology. His expertise and dedication to his work have made him a valuable asset to the company.
Collaborations
Chih-Yen Su collaborates with his coworker, Chun-Te Lin, to further advance their projects and share insights in the semiconductor field.
Conclusion
Chih-Yen Su's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the industry and provide effective solutions to enhance device performance.