Taoyuan, Taiwan

Chih-Wei Jen

This inventor holds 1 USPTO granted patent. Top assignee: Quanta Computer Incorporated. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Wei Jen. Retrieved from https://idiyas.com/inventor/chih-wei-jen-h5xe8s2c

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Chih-Wei Jen: Innovator in Heat Dissipation Technology

Introduction

Chih-Wei Jen is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronic devices, particularly in heat dissipation technology. His innovative approach has led to the development of a unique patent that addresses critical challenges in thermal management.

Latest Patents

Chih-Wei Jen holds a patent for a "Heat dissipation assembly and electronic device using the same." This invention features a heat dissipation assembly that includes a pressing unit and a heat dissipation module. The pressing unit consists of a pressing plate, multiple elastic cantilevers, and contacting members. The design allows a heat source to be effectively sandwiched between the pressing plate and a bottom plate, enhancing thermal management in electronic devices.

Career Highlights

Chih-Wei Jen is associated with Quanta Computer Incorporated, a leading company in the technology sector. His work focuses on improving the efficiency of electronic devices through innovative heat dissipation solutions. With a patent portfolio that includes 1 patent, he has established himself as a key player in his field.

Collaborations

Chih-Wei Jen has collaborated with talented coworkers such as Chih-Chao Chen and Pei-Yu Chang. Their combined expertise contributes to the advancement of technology within their organization.

Conclusion

Chih-Wei Jen's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His work not only enhances device performance but also paves the way for future advancements in thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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