The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2019

Filed:

Apr. 13, 2017
Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventors:

Chih-Chao Chen, Taoyuan, TW;

Pei-Yu Chang, Taoyuan, TW;

Chia-Hung Ma, Taoyuan, TW;

Chih-Wei Jen, Taoyuan, TW;

Assignee:

Quanta Computer Inc., Taoyuan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01); F28D 15/02 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); F28D 15/0275 (2013.01); H01L 23/427 (2013.01); H01L 23/3672 (2013.01); H01L 23/4006 (2013.01);
Abstract

A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.


Find Patent Forward Citations

Loading…