Hsinchu, Taiwan

Chih-Shin Tsai

This inventor holds 1 USPTO granted patent. Top assignee: Mosel Vitelic Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Shin Tsai. Retrieved from https://idiyas.com/inventor/chih-shin-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovations of Chih-Shin Tsai

Introduction

Chih-Shin Tsai is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer reclamation and reuse. His innovative methods have the potential to enhance the efficiency of semiconductor manufacturing processes.

Latest Patents

Chih-Shin Tsai holds a patent for a "Method for reclaiming and reusing wafers." This invention provides a systematic approach to reclaiming used, nonproductive wafers. The method involves oxidizing parts of a polysilicon layer on the wafer, which ultimately improves the quality of the deposition process on productive wafers. This patent showcases his commitment to advancing semiconductor technology and sustainability.

Career Highlights

Chih-Shin Tsai is associated with Mosel Vitelic Corporation, where he has been instrumental in developing innovative solutions in semiconductor manufacturing. His work has contributed to the company's reputation as a leader in the industry. With a focus on improving processes, Tsai's contributions are vital to the ongoing evolution of semiconductor technology.

Collaborations

Chih-Shin Tsai has collaborated with notable colleagues such as Shih-Chi Lai and Jen-Chieh Chang. These partnerships have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Chih-Shin Tsai's work exemplifies the spirit of innovation in the semiconductor industry. His patent for reclaiming and reusing wafers is a testament to his dedication to improving manufacturing processes. Through his career and collaborations, Tsai continues to make a significant impact in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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