This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chih-Ming Liu: Innovator in Power Module Packaging
Introduction
Chih-Ming Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in power module packaging structures. His innovative work has led to the development of a patent that enhances the efficiency and reliability of power modules.
Latest Patents
Chih-Ming Liu holds a patent for a "Power Module Packaging Structure." This invention addresses critical challenges in the design and functionality of power modules, showcasing his expertise and commitment to advancing semiconductor technology. He has 1 patent to his name, reflecting his innovative contributions to the industry.
Career Highlights
Liu is currently employed at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor packaging and testing industry. His role at the company allows him to work on cutting-edge technologies and collaborate with other talented professionals in the field.
Collaborations
Chih-Ming Liu has worked alongside esteemed colleagues such as Yung-Fa Chen and Hung Cheng Chang. Their collaborative efforts contribute to the advancement of semiconductor technologies and innovations.
Conclusion
Chih-Ming Liu's work in power module packaging exemplifies the spirit of innovation in the semiconductor industry. His contributions not only enhance the performance of power modules but also pave the way for future advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile