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For the Inventor, By the Inventor

Taipei, Taiwan

Chih-Ming Lai

This inventor holds 39 USPTO granted patents and 6 published patent applications and 12 EPO patents, primarily in Connector Technology. Top assignees: Giga-Byte Technology Co., Ltd., Opto Tech Corporation, Arima Lasers Corporation. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Ming Lai. Retrieved from https://idiyas.com/inventor/chih-ming-lai-oeo8xtr8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 39 

% Patents Active = 82.1

 

Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 85(Granted Patents)


Location History:

  • Sindian, TW (2006 - 2007)
  • Xindian, TW (2007)
  • Taipei County, TW (2010 - 2011)
  • Taipei Hsien, TW (2010 - 2012)
  • New Taipei, TW (2013 - 2024)

Company Filing History:

goldMedal35 out of 285 
 
Giga-Byte Technology Co., Ltd.
 patents
silverMedal2 out of 75 
 
Opto Tech Corporation
 patents
bronzeMedal1 out of 8 
 
Arima Lasers Corporation
 patents
4. 1 out of 19 
 
Foxtron Vehicle Technologies Co., Ltd.
 patents

Years Active: 2006-2025

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Areas of Expertise:
Connector Protection Device
Heat Dissipation Assembly
Circuit Board Module
Modular Vehicle Body
Memory Socket Assembly
Light Guide Bar
Electromagnetic Conduction
HDMI Assembly
Printed Circuit Board
Detection Device
Integrated Socket
Second-Harmonic Generation
39 patents (USPTO):Explore Patents
1. 12489243 - Connector protection device and circuit board module (2025-12-02),
2. 12477693 - Heat dissipation assembly and electric device thereof (2025-11-18),
3. 12374829 - Circuit board module and release component (2025-07-29),
4. 12160968 - Remote releasing module and circuit board device (2024-12-03),
5. 11917762 - Circuit board module (2024-02-27),
6. 11548578 - Modular vehicle body and method for manufacturing modular vehicle body (2023-01-10),
7. 11470737 - Casing assembly having a configuration for blocking extraneous material (2022-10-11),
8. 11406050 - Floated-type shielding mechanism and circuit board module (2022-08-02),
9. 11245233 - Cable concentrator and electronic device having the same (2022-02-08),
10. 11102913 - Heat dissipating assembly and main board module (2021-08-24),
11. 11098844 - Wall mount assembly (2021-08-24),
12. 11089684 - Motherboard module and electronic device (2021-08-10),
13. 10707601 - Memory socket protecting cover and memory socket assembly (2020-07-07),
14. 10379285 - Electronic device (2019-08-13),
15. 10154578 - Heat dissipater resilient structure and connector module (2018-12-11),

Title: Chih-Ming Lai: Pioneering Inventor from New Taipei

Introduction: Chih-Ming Lai is a distinguished inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chih-Ming Lai holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his versatility and ingenuity in inventing cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Chih-Ming Lai has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have revolutionized the industry.

Collaborations: Throughout his career, Chih-Ming Lai has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Chih-Ming Lai's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his position as a visionary inventor in the global tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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