The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jun. 08, 2017
Giga-byte Technology Co., Ltd., New Taipei, TW;
Chih-Ming Lai, New Taipei, TW;
Yung-Shun Kao, New Taipei, TW;
GIGA-BYTE TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
A heat dissipater resilient structure is adapted to be fixed to a connector of a motherboard and for an expansion card heat dissipater to be disposed on. The heat dissipater resilient structure includes a body, an arm and a fixing member. The body is adapted to be fixed to the connector. The arm extends from the body and is bendable between a first position and a second position. The fixing member is located at the body or the arm. The expansion card heat dissipater is adapted to be fixed to the fixing member and lean against the arm to move with the arm. When pressed, the expansion card heat dissipater is adapted to move with the arm from the first position to the second position. When not pressed, the arm moves with the expansion card heat dissipater to return to the first position. A connector module is further provided.