Company Filing History:
Years Active: 2010-2025
Title: Innovations of Chih-Hao Liao
Introduction
Chih-Hao Liao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging and electromagnetic interference shielding. With a total of eight patents to his name, Liao continues to push the boundaries of technology and innovation.
Latest Patents
Liao's latest patents include a chip package structure and an electromagnetic interference (EMI) shielding package module. The chip package structure features an encapsulant with a patterned trench and an EMI shielding layer that includes a recognition region and an embedded region. This design allows for a two-dimensional (2D) code pattern that meets the ISO/IEC 15415 standard. Additionally, he has developed an EMI shielding package structure that incorporates a carrier, chips, an encapsulant, and an insulating layer with unique features for enhanced performance.
Career Highlights
Chih-Hao Liao is currently employed at Azurewave Technologies, Inc., where he applies his expertise in developing advanced packaging solutions. His work has been instrumental in improving the reliability and efficiency of electronic devices.
Collaborations
Liao collaborates with talented coworkers such as Hsin-Yeh Huang and Shu-Han Wu, contributing to a dynamic team focused on innovation and excellence in technology.
Conclusion
Chih-Hao Liao's contributions to the field of chip packaging and EMI shielding demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and a drive to enhance electronic device performance.