Azurewave Technologies, Inc.

Chih-Hao Liao

Hsin-Yeh Huang

Shu-Han Wu

Chung-Er Huang

Meng-Hsin Kuo

A chip package structure and an electromagnetic interference (EMI) shielding package module thereof are provided. The EMI shielding package module includes an encapsulant, an EMI shielding layer, and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof. The EMI shielding layer includes a recognition region formed on the top surface and an embedded region that is filled in the patterned trench. The recognition contrast layer is filled in the patterned trench and is connected to the embedded region. The recognition contrast layer and the recognition region respectively have different colors that conform to grade A or grade B in ISO/IEC 15415 standard. An end portion of the recognition contrast layer protruding from the top surface is coplanar with the recognition region so as to jointly form a predetermined two-dimensional (2D) code pattern having a planar shape.

Chip package structure and electromagnetic interference shielding package module thereof

An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the carrier and packaging the at least one chip, an EMI shielding layer formed on an outer surface of the encapsulant, and an insulating layer. The insulating layer includes a spraying portion and a capillary permeating portion. The spraying portion is formed at least part of an outer surface of the EMI shielding layer. The capillary permeating portion is formed by extending from a bottom end of the spraying portion toward a second board surface of the carrier through capillarity, and the capillary permeating portion covers a bottom edge of the EMI shielding layer.

Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly

An image sensor lens assembly and a sensing module having an open configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, and an adhering layer. The supporting layer is not enclosed and has an internal communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the internal communication opening. The adhering layer is formed in a part of the ring-shaped gap so as to adhere the filtering sheet onto the circuit board and has an external communication opening. The internal communication opening, the ring-shaped gap, and the external communication opening are jointly formed as a dust-proof channel.

Image sensor lens assembly and sensing module having open configuration

An image sensor lens assembly and a sensing module having an externally sealed configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, a first adhering layer, and a second adhering layer. The supporting layer is not enclosed and has a communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the communication opening. The first adhering layer having a shape of an enclosed loop is formed in the ring-shaped gap. The second adhering layer is connected to and seals the image sensor chip and the circuit board.

Image sensor lens assembly and sensing module having externally sealed configuration

A chip scale package structure of heat-dissipating type is provided and includes a board, a die fixed on and electrically coupled to the board, a thermally conductive adhesive sheet adhered to the die, and a package body formed on the board. The die has a heat-output surface arranged away from the board. The thermally conductive adhesive sheet is connected to at least 50% of an area of the heat-output surface. The package body covers and is connected to the die and entire of the surrounding lateral surface of the thermally conductive adhesive sheet. The die is embedded in the board, the thermally conductive adhesive sheet, and the package body. The heat-dissipating surface of the thermally conductive adhesive sheet is exposed from the package body, and a thermal conductivity of the thermally conductive adhesive sheet is at least 150% of a thermal conductivity of the package body.

Chip scale package structure of heat-dissipating type

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 &#x3bc;m. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

Wireless communication device

A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved.

Parallel testing system with shared golden calibration table and method thereof

A multi-system module having a functional substrate includes a substrate comprising therein at least one control circuit units, and a plurality of main circuit units provided on one side surface of the substrate. The main circuit units are electrically connected to the control circuit unit, whereby the control circuit unit is used to manage the operation of the main circuit units. Via the above module structure, the substrate can improve the function of controlling multiple systems.

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Taipei, Taiwan

Chih-Hao Liao