The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Oct. 12, 2022
Applicant:

Azurewave Technologies, Inc., New Taipei, TW;

Inventors:

Chih-Hao Liao, Taipei, TW;

Hsin-Yeh Huang, Taipei, TW;

Shu-Han Wu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/544 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/544 (2013.01); H01L 25/165 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01);
Abstract

A chip package structure and an electromagnetic interference (EMI) shielding package module thereof are provided. The EMI shielding package module includes an encapsulant, an EMI shielding layer, and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof. The EMI shielding layer includes a recognition region formed on the top surface and an embedded region that is filled in the patterned trench. The recognition contrast layer is filled in the patterned trench and is connected to the embedded region. The recognition contrast layer and the recognition region respectively have different colors that conform to grade A or grade B in ISO/IEC 15415 standard. An end portion of the recognition contrast layer protruding from the top surface is coplanar with the recognition region so as to jointly form a predetermined two-dimensional (2D) code pattern having a planar shape.


Find Patent Forward Citations

Loading…