Company Filing History:
Years Active: 2022-2025
Title: Innovations of Shu-Han Wu
Introduction
Shu-Han Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging and electromagnetic interference shielding. With a total of four patents to his name, his work is recognized for its innovative approaches and practical applications.
Latest Patents
One of his latest patents is titled "Chip package structure and electromagnetic interference shielding package module thereof." This invention provides a chip package structure that includes an encapsulant, an EMI shielding layer, and a recognition contrast layer. The encapsulant features a patterned trench on its top surface, while the EMI shielding layer has a recognition region and an embedded region that fills the trench. The recognition contrast layer, which is filled in the trench, is designed to have different colors that conform to the ISO/IEC 15415 standard. This design allows for the creation of a two-dimensional code pattern with a planar shape.
Another significant patent is "Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly." This invention outlines an EMI shielding package structure that includes a carrier, at least one chip mounted on the carrier, and an encapsulant that packages the chip. The structure also features an insulating layer with a spraying portion and a capillary permeating portion, enhancing the overall functionality of the package.
Career Highlights
Shu-Han Wu is currently employed at Azurewave Technologies, Inc., where he continues to innovate in the field of electronics. His work focuses on developing advanced packaging solutions that address the challenges of electromagnetic interference in electronic devices.
Collaborations
He has collaborated with notable coworkers, including Chih-Hao Liao and Hsin-Yeh Huang, contributing to the advancement of technology in their respective fields.
Conclusion
Shu-Han Wu's contributions to chip packaging and electromagnetic interference shielding demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in electronic assembly and packaging solutions.