Company Filing History:
Years Active: 2022-2025
Title: Innovations of Hsin-Yeh Huang in Electromagnetic Interference Shielding
Introduction
Hsin-Yeh Huang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging and electromagnetic interference (EMI) shielding. With a total of four patents to his name, Huang's work is recognized for its innovative approaches to enhancing electronic assembly technologies.
Latest Patents
Huang's latest patents include a chip package structure and an electromagnetic interference shielding package module. The chip package structure features an encapsulant with a patterned trench and an EMI shielding layer that includes a recognition region and an embedded region. This design allows for a two-dimensional (2D) code pattern that meets the ISO/IEC 15415 standard. Additionally, his patent on the EMI shielding package structure outlines a manufacturing method that incorporates a carrier, chips, an encapsulant, and an insulating layer, enhancing the overall performance of electronic assemblies.
Career Highlights
Hsin-Yeh Huang is currently employed at Azurewave Technologies, Inc., where he continues to innovate in the field of electronic packaging. His work has not only advanced the technology but has also contributed to the efficiency and reliability of electronic devices.
Collaborations
Huang collaborates with talented coworkers such as Chih-Hao Liao and Shu-Han Wu, who contribute to the innovative environment at Azurewave Technologies, Inc.
Conclusion
Hsin-Yeh Huang's contributions to the field of electromagnetic interference shielding and chip packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications in modern electronics.