Taipei, Taiwan

Chih-Chung Wu

This inventor holds 1 USPTO granted patent. Top assignee: National Yang Ming Chiao Tung University. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Chung Wu. Retrieved from https://idiyas.com/inventor/chih-chung-wu-xq5ftxrb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Chih-Chung Wu in Thin Film Fabrication

Introduction

Chih-Chung Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thin film fabrication, showcasing his expertise through his innovative patent.

Latest Patents

Wu holds a patent for a method of fabricating a thin film with varying thickness. This method involves several steps, including providing a shadow mask with an opening, arranging a substrate on a carrier plate, and coating the substrate through the opening while rotating the carrier plate relative to the shadow mask. The process allows for a plurality of zones of the substrates to be swept and exposed from arcuate portions of the opening during each turn, with varying predetermined exposure times. The resulting varying thickness of the thin film corresponds to the variation in these exposure times.

Career Highlights

Chih-Chung Wu is affiliated with National Yang Ming Chiao Tung University, where he continues to advance research in his field. His work has garnered attention for its innovative approach to thin film technology.

Collaborations

Wu has collaborated with notable colleagues, including Cheng-Sheng Huang and Chi-Yung Hsieh, contributing to advancements in their shared research interests.

Conclusion

Chih-Chung Wu's contributions to thin film fabrication highlight his innovative spirit and dedication to advancing technology in this area. His patent reflects a significant step forward in the field, showcasing the potential for further developments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…