Chih-Cheng Kuo

Title: Chih-Cheng Kuo: Innovator in Semiconductor Technology

Introduction

Chih-Cheng Kuo is an inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

One of his notable applications is for a method involving a selective metal cap in an interconnect structure. This method includes forming an opening in a dielectric layer to expose a metal feature, selectively depositing a metal cap on the metal feature, depositing a barrier layer over the metal cap, and depositing a conductive fill on the barrier layer. Another significant application focuses on low contact resistance vias in backend interconnect structures. This method involves forming a via in a first dielectric layer over a substrate, followed by the formation of a second dielectric layer. An opening is created in the second dielectric layer to expose the upper surface of the via, and a capping layer is selectively formed over the upper surface of the via. This capping layer has a curved upper surface that extends above the first upper surface of the first dielectric layer. After forming the capping layer, a barrier layer is created in the opening over the capping layer, and the opening is filled with an electrically conductive material.

Conclusion

Chih-Cheng Kuo is an innovative inventor whose work in semiconductor technology showcases his potential in the field. His latest patent applications reflect his commitment to advancing technology, even in the absence of granted patents.