This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Industrial Technology Research Institute. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chih-Cheng Hsiao: Innovator in Package Structures
Introduction
Chih-Cheng Hsiao is an inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of package structures and manufacturing methods. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
One of Hsiao's notable patent applications is titled "PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF." This application describes a package structure that includes a first package assembly and a second package assembly. The first package assembly consists of a first dielectric layer, a first chip, and a first conductive structure. The first chip is positioned within the first dielectric layer, with a first electrical connection surface of the first conductive structure exposed on a first bonding surface of the first dielectric layer. The second package assembly comprises a second dielectric layer, a second chip, and a second conductive structure. The second chip is located in the second dielectric layer, with a second electrical connection surface of the second conductive structure exposed on a second bonding surface of the second dielectric layer. The first bonding surface is directly bonded to the second bonding surface, and the first electrical connection surface is directly bonded to the second electrical connection surface.
Another application by Hsiao is for a "PACKAGE STRUCTURE," which includes a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure. The circuit structure layer is placed on the circuit board. The bridge structure connects two adjacent circuit structure layers. The supporting structure is situated between these layers, featuring a first end and a second end that connect the bridge structure and the circuit board.
Conclusion
Chih-Cheng Hsiao is an innovative inventor whose work in package structures showcases his potential in the field. His latest patent applications reflect his commitment to advancing technology in this area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile