The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Jan. 03, 2023
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Yu-Wei Huang, Chiayi City, TW;

Ching-Feng Yu, Miaoli County, TW;

Chih-Cheng Hsiao, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/181 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H10W 90/401 (2026.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/1053 (2013.01);
Abstract

A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.


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