This inventor holds 1 USPTO granted patent. Top assignee: Walsin Advanced Electronics Ltd.. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: Innovations by Chien-Tsun Lin in Semiconductor Packaging
Introduction
Chien-Tsun Lin is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the functionality and reliability of semiconductor devices.
Latest Patents
Chien-Tsun Lin holds a patent for a semiconductor package with metal pads. This invention involves a semiconductor package, such as QFN or SON, which includes a die and a protective package body. The design features a plurality of leads, with metal pads formed on the downside surface of the package body. Each lead has a cutting surface exposed on the lateral surface of the package body, ensuring coplanarity with the metal pads. The innovative design avoids sharp edges by selectively self-etching the leads or stamping them to bend, enhancing the safety and efficiency of the semiconductor package. He has 1 patent to his name.
Career Highlights
Chien-Tsun Lin is currently employed at Walsin Advanced Electronics Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of electronic devices.
Collaborations
Chien-Tsun Lin has collaborated with talented coworkers, including Chien-Hung Lai and Chun-Jen Su, to further enhance the innovations in their field.
Conclusion
Chien-Tsun Lin's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the industry, showcasing his expertise and dedication to improving electronic devices.