Chien-Tang Peng

Title: Chien-Tang Peng: Innovator in Semiconductor Technology

Introduction

Chien-Tang Peng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and structure of semiconductor packages. His innovative work has led to the development of advanced solutions that enhance the performance and reliability of electronic devices.

Latest Patents

Chien-Tang Peng holds a patent for "Semiconductor packages having a seed layer structure protruding from an edge of metal structure." This patent describes conductive structures, semiconductor packages, and methods of forming the same. The semiconductor package includes at least one die and a redistribution layer, which is disposed over and electrically connected to the die. The redistribution layer features a seed layer structure and a metal feature, with the edge of the seed layer structure protruding from the edge of the metal feature, exhibiting a surface roughness Rz greater than 10 nm.

Career Highlights

Chien-Tang Peng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to be at the forefront of semiconductor innovation, contributing to the advancement of technology in this critical field.

Collaborations

Chien-Tang Peng has collaborated with notable colleagues, including Hung-Jui Kuo and Hui-Jung Tsai. These collaborations have fostered a productive environment for innovation and have led to the development of cutting-edge semiconductor technologies.

Conclusion

Chien-Tang Peng's contributions to semiconductor technology exemplify the impact of innovative thinking in the electronics industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key player in advancing semiconductor solutions.