Company Filing History:
Years Active: 2025
Title: Innovations of Chien Ta Huang in 3D Integrated Circuits.
Introduction
Chien Ta Huang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of integrated circuits, particularly in the area of heat dispersion techniques for 3D integrated circuits. His innovative work has led to the development of a patented method that enhances the performance and reliability of these advanced technologies.
Latest Patents
Chien Ta Huang holds a patent for "Techniques for heat dispersion in 3D integrated circuit." This patent describes a method of forming a redistribution layer (RDL) stack of a 3D integrated circuit stack. The method involves removing a substrate from the first side of a first die to expose a first dielectric layer. A spiral trench is formed in the first dielectric layer, with one end of the spiral trench directly over a through silicon via (TSV) beneath the first dielectric layer. A first barrier layer is formed along the sidewalls of the spiral trench, thermally coupled to the TSV. Finally, a first conductive wire is formed within the spiral trench, separated from the first dielectric layer by the barrier layer. This innovative approach addresses critical challenges in heat management within 3D integrated circuits.
Career Highlights
Chien Ta Huang is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to focus on cutting-edge technologies and contribute to advancements in integrated circuit design and manufacturing.
Collaborations
Chien Ta Huang has collaborated with talented individuals such as Chun-Yang Tsai and Yi Ching Ong. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies in the semiconductor field.
Conclusion
Chien Ta Huang's contributions to the field of 3D integrated circuits through his patented techniques for heat dispersion demonstrate his commitment to innovation. His work not only enhances the performance of integrated circuits but also paves the way for future advancements in semiconductor technology.