Company Filing History:
Years Active: 2016-2022
Title: Chien-Ping Lee: Innovator in Chemical Mechanical Polishing Technologies
Introduction
Chien-Ping Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of chemical mechanical polishing (CMP) processes. With a total of 3 patents, his work has advanced the efficiency and effectiveness of cleaning integrated circuit (IC) wafers.
Latest Patents
Chien-Ping Lee's latest patents focus on innovative methods and systems for chemical mechanical polish cleaning. One of his notable inventions involves methods for cleaning IC wafers after undergoing planarization processes, such as chemical mechanical polishing. This patent discloses a method that configures outlet areas of spray nozzles to deliver a cleaning solution to optimal locations on the IC wafer. The method ensures that the cleaning solution reaches specific areas of the wafer at particular velocities, enhancing the cleaning process. Another patent provides a cleaning unit designed for CMP processes, which includes a brush for scrubbing the wafer and a spray nozzle for applying the cleaning solution during the scrubbing process.
Career Highlights
Chien-Ping Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced cleaning technologies that are crucial for maintaining the quality of semiconductor devices. His expertise in CMP processes has positioned him as a key player in the field.
Collaborations
Chien-Ping Lee has collaborated with notable colleagues, including Hui-Chi Huang and I-Shuo Liu. These partnerships have fostered innovation and contributed to the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Chien-Ping Lee's contributions to the field of chemical mechanical polishing have significantly impacted the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in wafer cleaning technologies.