This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Innovations of Chien-Ning Hsin
Introduction
Chien-Ning Hsin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique method for fusion bonding substrates, which is crucial in various applications.
Latest Patents
Chien-Ning Hsin holds 1 patent titled "Preconditioning to enhance hydrophilic fusion bonding." This patent describes a method for fusion bonding a pair of substrates together using silane preconditioning. The process involves preconditioning the surface of a first or second oxide layer with silane, applying water to the surface, and bringing the surfaces into direct contact. The layers are then annealed, which is essential for manufacturing microelectromechanical systems (MEMS) packages.
Career Highlights
Chien-Ning Hsin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing technologies that enhance the performance and reliability of semiconductor devices.
Collaborations
Chien-Ning Hsin has collaborated with talented individuals such as Jen-Hao Liu and Chih-Hang Chang. Their teamwork has contributed to the successful development of innovative solutions in the semiconductor field.
Conclusion
Chien-Ning Hsin's contributions to semiconductor technology through his patent and collaborations highlight his role as a significant inventor in the industry. His innovative methods continue to influence advancements in microelectromechanical systems and fusion bonding techniques.