Taipei, Taiwan

Chien-Ming Lai


Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2024

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6 patents (USPTO):Explore Patents

Title: The Innovations of Chien-Ming Lai: Advancements in Surface-treated Copper Foils

Introduction: Chien-Ming Lai, an accomplished inventor based in Taipei, Taiwan, has made significant contributions to the field of material science through his innovative work on surface-treated copper foils. With a total of six patents to his name, his research focuses on enhancing the properties of copper materials for various industrial applications.

Latest Patents: Chien-Ming Lai's latest innovations include two groundbreaking patents related to surface-treated copper foil and copper clad laminates. The first patent outlines a surface-treated copper foil that features a treated surface with a peak extreme height (Sxp) ranging from 0.4 to 3.0 μm. This foil exhibits remarkable stability when subjected to heat, maintaining a specific ratio of integrated intensities of diffraction peaks after heating at 200° C for one hour. The second patent details a similar surface-treated copper foil, where the root mean square height (Sq) of the treating surface is within 0.20 to 1.50 μm, while the texture aspect ratio (Str) does not exceed 0.65. This innovation also retains structural integrity under heat, showcasing a minimum ratio of diffraction peak intensities.

Career Highlights: Chien-Ming Lai is currently associated with Chang Chun Petrochemical Co., Ltd., where he leverages his expertise in material science to drive innovation. His dedication to research and development in the field has established him as a key figure in the industry.

Collaborations: Throughout his career, Lai has collaborated with fellow researchers, including Yao-Sheng Lai and Jui-Chang Chou. Their partnership has contributed to advancements in copper material technology, fostering an environment of innovation and discovery.

Conclusion: The work of Chien-Ming Lai exemplifies the spirit of innovation within the materials science sector. His patents not only enhance the capabilities of copper materials but also pave the way for future developments in related technologies. As he continues to push the boundaries of invention, his contributions are sure to have a lasting impact on the industry.

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