The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Dec. 16, 2019
Applicant:
Chang Chun Petrochemical Co., Ltd, Taipei, TW;
Inventors:
Assignee:
CHANG CHUN PETROCHEMICAL CO., LTD., Taipei, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); H05K 1/09 (2006.01); C25D 1/04 (2006.01); C25D 3/38 (2006.01); B32B 15/01 (2006.01); C25D 5/10 (2006.01); C25D 3/12 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); C25D 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 15/01 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C25D 1/04 (2013.01); C25D 3/12 (2013.01); C25D 3/22 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0355 (2013.01); Y10T 428/12431 (2015.01);
Abstract
Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 μm/μm. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.