Chang Chun Petrochemical Co., Ltd.

Chien-Ming Lai

Yao-Sheng Lai

Jui-Chang Chou

Kuei-Sen Cheng

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of () plane to the sum of the integrated intensities of diffraction peaks of () plane, () plane, and () plane of the treating surface is at least 60%.

Surface-treated copper foil and copper clad laminate

A surface-treated copper foil including a treating surface, where the root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 &#x3bc;m and the texture aspect ratio (Str) of the treating surface is not greater than 0.65. When the surface-treated copper foil is heated at a temperature of 200&#xb0; C. for 1 hour, the ratio of the integrated intensity of () peak to the sum of the integrated intensities of () peak, () peak, and () peak of the treating surface is at least 60%.

Surface-treated copper foils exhibiting a void volume (Vv) in a range of 0.4 to 2.2 &#x3bc;m/&#x3bc;mand an arithmetic mean waviness (Wa) lower than or equal to 0.4 &#x3bc;m are reported. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Surface treated copper foil

Electrodeposited copper foils possessing properties for manufacturing lithium ion rechargeable secondary batteries are described, including methods of making the electrodeposited copper foils, methods for making the battery, and the resultant battery. The electrodeposited copper foils have a specific burst strength in the range of 1.5 to 4.3 kPa*m/g and a tensile strength in the range of 30 to 40 kgf/mm. The deposited side of the electrodeposited copper foil has a surface hardness in the range of 0.2 to about 2.0 Gpa by nano indentation analysis to resist wrinkling during pressing of the active materials on the electrodeposited copper foil. The foil exhibits reduced copper burr formation and burr size after clipping.

Electrodeposited copper foil with anti-burr property

Surface-treated copper foils that exhibit a material volume (Vm) less than 1.90 &#x3bc;m/&#x3bc;m. Where the surface-treated copper foil is treated on the drum side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.

Low transmission loss copper foil and methods for manufacturing the copper foil

Provided is an electrolytic copper foil. The electrolytic copper foil has a drum side and a deposited side, wherein &#x394;Rz is less than 0.8 &#x3bc;m; the electrolytic copper foil has a transverse direction, wherein the electrolytic copper foil is divided into 10 test pieces with the same width and the same length, and each two adjacent ones of the 10 test pieces have a weight deviation therebetween, and a count of the weight deviation(s) greater than or equal to 1.5% is smaller than a count of the weight deviations smaller than 1.5%; wherein n represents any one of the test piece numbers from 1 to 9, and the 

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Chien-Ming Lai