Chien Ming Chen

Title: Innovations by Chien Ming Chen in Semiconductor Device Strength Measurement

Introduction

Chien Ming Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the measurement and prediction of package and die strength. His innovative work has implications for the durability and reliability of semiconductor devices.

Latest Patents

Chien Ming Chen holds a patent for "Methods and assemblies for measurement and prediction of package and die strength." This patent discloses systems and methods for measuring and predicting the strength of semiconductor devices and packaging. The semiconductor device assembly described in the patent includes a package substrate, a semiconductor die electrically coupled to the package substrate, and a molding that covers at least a portion of the semiconductor die. The molding features a through-mold via (TMV) that extends from an upper surface into the mold material to a specific depth. A strain gauge is incorporated within the molding at the depth of the TMV, allowing for the measurement of strain at critical areas of the semiconductor device assembly. This technology is particularly useful in testing the strength of semiconductor devices under real-world conditions, such as being dropped, bent, or crushed.

Career Highlights

Chien Ming Chen is currently employed at Micron Technology Incorporated, where he continues to advance his research and development efforts in semiconductor technology. His work is instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Chien Ming Chen has collaborated with notable colleagues, including Shams U Arifeen and Christopher Glancey. These collaborations have contributed to the advancement of innovative solutions in the semiconductor industry.

Conclusion

Chien Ming Chen's contributions to semiconductor technology through his patent on measuring and predicting package and die strength highlight his role as an influential inventor in the field. His work not only enhances the understanding of semiconductor device durability but also paves the way for future innovations in the industry.