Chien Li

Title: Innovations by Chien Li in Semiconductor Packaging

Introduction

Chien Li is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent that enhances the reliability and quality of semiconductor packages.

Latest Patents

Chien Li holds a patent for a semiconductor package and method of manufacturing. This patent describes a semiconductor package that includes an integrated circuit die mounted to an interposer using connection structures. The underfill material between the integrated circuit die and the interposer features shaped fillets that are positioned below the plane of the bottom surface of the integrated circuit die. This design reduces the likelihood of stresses and strains damaging the mold compound, thereby improving the overall quality and reliability of the semiconductor package. By enhancing these aspects, the yield of the semiconductor package can increase, ultimately decreasing production costs. Chien Li's patent is a testament to his innovative approach in the semiconductor industry, with 1 patent to his name.

Career Highlights

Chien Li is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work focuses on advancing semiconductor packaging technologies, which are crucial for the performance and reliability of electronic devices.

Collaborations

Chien Li has collaborated with esteemed colleagues such as Shin-Puu Jeng and Chih-Ju Yen. Their combined expertise contributes to the innovative projects within the semiconductor field.

Conclusion

Chien Li's contributions to semiconductor packaging through his patent demonstrate his commitment to innovation and quality in technology. His work not only enhances product reliability but also contributes to cost efficiency in semiconductor manufacturing.