This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2020-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020-2023
Title: Innovations by Chien-Kang Hsiung
Introduction
Chien-Kang Hsiung is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of substrate processing and wafer-level die bridge technology. With a total of 2 patents, his work has advanced the capabilities of semiconductor manufacturing.
Latest Patents
Hsiung's latest patents include "Methods and apparatus for processing a substrate" and "Methods and apparatus for wafer-level die bridge." The first patent outlines a method that involves depositing multiple layers of metal on substrates and bonding them through diffusion layers. The second patent describes a wafer-level bridge die that is affixed to a redistribution layer, with electrical interconnects formed and encapsulated in a mold layer.
Career Highlights
Chien-Kang Hsiung is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His innovative approaches have contributed to the development of advanced manufacturing techniques.
Collaborations
Hsiung has collaborated with notable coworkers such as Arvind Sundarrajan and Yuichi Wada, further enhancing the impact of his work in the industry.
Conclusion
Chien-Kang Hsiung's contributions to substrate processing and wafer-level technology demonstrate his expertise and innovative spirit in the semiconductor field. His patents reflect a commitment to advancing manufacturing processes, making him a significant figure in his area of expertise.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile