Hsinchu, Taiwan

Chien-Hao Liu

This inventor holds 1 USPTO granted patent. Top assignee: Tsinghua University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Hao Liu. Retrieved from https://idiyas.com/inventor/chien-hao-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Chien-Hao Liu in Radiative Cooling Technology

Introduction

Chien-Hao Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of radiative cooling technology. His innovative work focuses on the development of advanced materials and methods for efficient heat dissipation.

Latest Patents

Chien-Hao Liu holds 1 patent for his invention titled "Radiation heat dissipation substrate, radiative cooling device containing the same and preparation method thereof." This patent describes a radiative cooling substrate that consists of a broadband radiation absorption layer, a metal substrate, and a wavelength-selective infrared emission layer. The preparation method involves a straightforward process of placing the metal substrate into an electrophoresis tank and depositing the necessary layers on either side of the substrate.

Career Highlights

Chien-Hao Liu is affiliated with Tsinghua University, where he continues to engage in research and development in the field of materials science. His work has implications for energy efficiency and thermal management in various applications.

Collaborations

Chien-Hao Liu has collaborated with notable colleagues such as Yu-Bin Chen and Chih-Chan Chiang. Their combined expertise contributes to the advancement of innovative technologies in their field.

Conclusion

Chien-Hao Liu's contributions to radiative cooling technology exemplify the importance of innovation in addressing modern thermal management challenges. His work not only enhances our understanding of heat dissipation but also paves the way for future advancements in energy-efficient materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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