The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2026

Filed:

Jan. 02, 2024
Applicant:

National Tsing Hua University, Hsinchu, TW;

Inventors:

Yu-Bin Chen, Hsinchu, TW;

Chih-Chan Chiang, Hsinchu, TW;

Jui-Yung Chang, Hsinchu, TW;

Cheng-Yang Liu, Hsinchu, TW;

Chien-Hao Liu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); C25D 13/04 (2006.01); C25D 13/12 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); C25D 13/04 (2013.01); C25D 13/12 (2013.01);
Abstract

Provided is a radiative cooling substrate, sequentially composed of a broadband radiation absorption layer, a metal substrate, and a wavelength-selective infrared emission layer. Also provided is a method for preparing the aforementioned radiative cooling substrate, which simply involves placing the metal substrate into an electrophoresis tank and depositing the broadband radiation absorption layer and the wavelength-selective infrared emission layer on the two sides of the metal substrate, respectively. Additionally, a radiative cooling device, comprising the above-mentioned radiative cooling substrate, is also provided.


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Chen, Yu-Bin. (2026). Radiation heat dissipation substrate, radiative cooling device containing the same and preparation method thereof (U.S. Patent No. 12638255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12638255

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