This inventor holds 9 USPTO granted patents and 28 published patent applications. Top assignee: Celsia Technologies Taiwan, Inc.. Active years: 2009-2017.
Location History:
- Zhongli, TW (2009 - 2014)
- Taoyuan County, TW (2017)
Company Filing History:
Years Active: 2009-2017
Title: Chieh-Ping Chen: Innovator in Heat Management Technologies
Introduction
Chieh-Ping Chen is a prominent inventor based in Zhongli, Taiwan. He has made significant contributions to the field of heat management technologies, holding a total of 9 patents. His innovative designs focus on improving the efficiency and effectiveness of heat dissipation systems.
Latest Patents
Among his latest patents, Chen has developed a heat sink of a metallic shielding structure. This invention includes a heating module and a cooling module, where the heating module features a heat generating component that is electrically connected to a substrate. The cooling module contains a body with a working fluid designed to enhance heat dissipation. Another notable patent is a heat-dissipating module that incorporates a loop-type vapor chamber. This module consists of a heat-dissipating body and a loop-type vapor chamber that is completely covered by the body. The design includes a vacuum chamber and a wick structure that optimizes heat transfer.
Career Highlights
Chieh-Ping Chen is currently employed at Celsia Technologies Taiwan, Inc., where he continues to innovate in the field of thermal management. His work has been instrumental in advancing technologies that are crucial for various applications, particularly in electronics and energy systems.
Collaborations
Chen has collaborated with several talented individuals in his field, including George Anthony Meyer, Iv, and Chien-Hung Sun. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Chieh-Ping Chen's contributions to heat management technologies exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of thermal dynamics and a commitment to improving efficiency in various applications.