The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Oct. 16, 2015
Applicant:
Celsia Technologies Taiwan, Inc., Taoyuan County, TW;
Inventors:
George A. Meyer, IV, Morgan Hill, CA (US);
Hsin-Hua Wen, Taoyuan County, TW;
Ming-Kuei Hsieh, Taoyuan County, TW;
Chieh-Ping Chen, Taoyuan County, TW;
Assignee:
CELSIA TECHNOLOGIES TAIWAN, INC., Taoyuan, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/40 (2013.01); H01L 23/473 (2013.01); H05K 1/0204 (2013.01); H05K 7/2029 (2013.01);
Abstract
A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.