This inventor holds 3 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Jess-Link Products Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chieh-Ming Cheng: Innovator in Bus Connection Wire Technology
Introduction
Chieh-Ming Cheng is a notable inventor based in New Taipei City, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the design of bus connection wire structures. His innovative approach has led to the development of a unique soldering structure that enhances the efficiency and reliability of electronic connections.
Latest Patents
Chieh-Ming Cheng holds a patent for a "Bus connection wire forward soldering structure." This invention includes a circuit board, a flat cable, and a fixing member. The circuit board features a solder area, a docking area, first and second surfaces, and an outgoing line direction. The solder area is located on the first surface, while the flat cable comprises a solder terminal, first and second attaching sections, a folding section, and a main body section. The solder terminal is positioned to face the docking area and is electrically connected to the solder area. The folding section connects the first and second attaching sections, and the main body section extends along the outgoing line direction. The fixing member covers the solder terminal, folding section, and attaching sections, with a notch defined at the junction of the second attaching section and the main body section.
Career Highlights
Chieh-Ming Cheng is associated with Jess-Link Products Co., Ltd., a company known for its advancements in electronic connectivity solutions. His work at Jess-Link has allowed him to focus on innovative designs that improve the functionality of electronic components.
Collaborations
Chieh-Ming Cheng collaborates with his coworker, Wen-Yu Wang, to further enhance their projects and drive innovation within their field.
Conclusion
Chieh-Ming Cheng's contributions to the field of electrical engineering, particularly through his patented bus connection wire forward soldering structure, demonstrate his commitment to innovation. His work continues to influence the design and functionality of electronic connections, showcasing the importance of inventive thinking in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile