The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2026

Filed:

Nov. 30, 2023
Applicant:

Jess-link Products Co., Ltd., New Taipei City, TV;

Inventors:

Wen-Yu Wang, New Taipei City, TW;

Chieh-Ming Cheng, New Taipei City, TW;

Assignee:

JESS-LINK PRODUCTS CO., LTD., New Taipei City, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/62 (2011.01); H05K 1/11 (2006.01); H01B 7/08 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H01R 12/62 (2013.01); H05K 1/115 (2013.01); H05K 1/117 (2013.01); H01B 7/08 (2013.01); H01R 12/72 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10356 (2013.01);
Abstract

A bus connection cable reverse-welding structure includes a circuit board, a flat cable, and a first line. The circuit board includes a wiring side, an insertion side, a welding area, a first mating area. A wire exit direction is defined from the wiring side toward the insertion side. The welding area is on the wiring side, and the first mating area is on the insertion side. The flat cable includes a main segment, an attached segment, and a welding end. The main segment extends along the wire exit direction, and the attached segment is attached on the circuit board. The welding end is electrically connected to the welding area. The first line is arranged in the circuit board and includes a first embedded segment and a first extension segment. The first embedded segment is embedded in the circuit board and connected to the welding area.


Find Patent Forward Citations

Loading…