This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Chieh Chan: Innovator in Chip Packaging Technology
Introduction
Chieh Chan is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative approach has led to the development of a unique chip package that enhances the efficiency and functionality of semiconductor devices.
Latest Patents
Chieh Chan holds 1 patent for his invention titled "Chip package and manufacturing method thereof." This patent describes a chip package that includes a semiconductor structure and a redistribution layer. The semiconductor structure features a substrate, a first isolation layer, and a lower ground pad. The substrate has a top surface, a bottom surface opposite to the top surface, a through hole that connects both surfaces, and a sidewall surrounding the through hole. The first isolation layer is positioned on the top surface of the substrate, while the lower ground pad is situated within the through hole. The redistribution layer extends from the bottom surface of the substrate to the lower ground pad along the sidewall, covering the entire bottom surface of the substrate and establishing an electrical connection with the lower ground pad.
Career Highlights
Chieh Chan is currently employed at Xintec Corporation, where he continues to push the boundaries of semiconductor technology. His work at Xintec has been instrumental in advancing chip packaging methods, which are crucial for the performance of modern electronic devices.
Collaborations
Chieh Chan collaborates with his coworker, Yen-Chen Lee, to further enhance their research and development efforts in the semiconductor industry.
Conclusion
Chieh Chan's innovative contributions to chip packaging technology exemplify the importance of creativity and collaboration in the field of semiconductor advancements. His work not only showcases his expertise but also highlights the potential for future innovations in this critical area of technology.