This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: Innovations of Chian Ping Huang in Semiconductor Packaging
Introduction
Chian Ping Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and methods. His work focuses on enhancing the efficiency and miniaturization of semiconductor packages.
Latest Patents
Chian Ping Huang holds a patent for a "Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof." This invention integrates multiple passive devices beneath a semiconductor chip, which increases the layout capacity of passive devices within the package. This design not only enhances substrate routability but also minimizes the occupied area, contributing to the overall miniaturization of the semiconductor package. Additionally, the encapsulation of passive devices with an insulative material prior to the molding process prevents dislocation during high-temperature molding, ensuring the quality and reliability of the packaged product.
Career Highlights
Chian Ping Huang is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing the technology and efficiency of semiconductor packaging solutions.
Collaborations
Chian Ping Huang has collaborated with notable colleagues such as Chi Chuan Wu and Jui-Yu Chuang. Their combined expertise has contributed to the successful development of innovative semiconductor technologies.
Conclusion
Chian Ping Huang's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patented designs and methods continue to influence the industry, ensuring the advancement of technology in semiconductor applications.