Company Filing History:
Years Active: 2016
Title: Innovations of Chia-Kai Shih in Semiconductor Technology
Introduction
Chia-Kai Shih is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to packaging and fabrication methods.
Latest Patents
One of his latest patents is titled "Semiconductor package and fabrication method thereof." This invention provides a semiconductor package that includes a first semiconductor device with conductive balls on its top surface and a second semiconductor device with conductive posts on its bottom surface. The conductive posts are bonded to the conductive balls, allowing for efficient electrical connections between the two devices. The design enables easy control of the package height, making it suitable for fine-pitch conductive balls.
Another significant patent by Chia-Kai Shih is the "Package on package structure and fabrication method thereof." This invention features a packaging substrate with conductive bumps and an electronic element stacked on it. The conductive posts of the electronic element bond to the conductive bumps, facilitating the stacking process through a butt joint. This innovative approach enhances the efficiency of the packaging process in semiconductor applications.
Career Highlights
Chia-Kai Shih is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work focuses on advancing packaging technologies that are crucial for modern electronic devices.
Collaborations
Chia-Kai Shih collaborates with talented coworkers, including Chu-Chi Hsu and Lung-Yuan Wang. Their combined expertise contributes to the innovative projects at Siliconware Precision Industries Co., Ltd.
Conclusion
Chia-Kai Shih's contributions to semiconductor technology through his patents reflect his commitment to innovation in the field. His work continues to influence the development of advanced packaging solutions for electronic devices.
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