Taichung City, Taiwan

Chia-Ju Yu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Ju Yu. Retrieved from https://idiyas.com/inventor/chia-ju-yu-w1b4flkv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chia-Ju Yu: Semiconductor Invention and Patent

Introduction

Chia-Ju Yu is an inventor associated with Taichung City, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His listed patent work concerns semiconductor structures and optical-die measurement.

Latest Patents

Yu is associated with 1 patent, titled “Semiconductor Structure and Method for Measuring the Optical Die.” The invention describes a semiconductor structure containing an optical die, a first edge coupler, and a reflective layer. The edge coupler and reflective layer are positioned within the optical die near its edge, with the reflective layer above and separated from the edge coupler. The structure is designed to support measurement of the optical die.

Career Highlights

Yu’s patent reflects work in semiconductor technology, particularly the design of optical-die structures and measurement methods. His listed professional affiliation is Taiwan Semiconductor Manufacturing Company Limited.

Collaborations

Yu’s named coworkers include Tai-chun Huang and Stefan Rusu. Their inclusion indicates professional connections in the semiconductor field, though specific joint projects are not provided in the supplied information.

Conclusion

Chia-Ju Yu’s listed invention focuses on a semiconductor structure for measuring an optical die, highlighting his contribution to optical and semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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