This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Mpi Corporation. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Innovations of Chia-Ju Wei
Introduction
Chia-Ju Wei is a notable inventor based in Chu-Pei, Taiwan. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. His work focuses on enhancing the functionality and efficiency of various devices.
Latest Patents
Chia-Ju Wei holds a patent for a "Probe head with linear probe." This invention includes upper and lower die units, with a linear probe inserted through them, defining tail, body, and head portions. The design features a first bottom surface of the upper die unit and a second top surface of the lower die unit that face each other, creating an inner space for the body portion. This body portion consists of multiple sections, each with a front width larger than or equal to the back width, including a narrowest section with specific distance measurements from the surfaces. The head and tail portions are offset along two horizontal axes, resulting in a curved body portion. This invention is advantageous for dynamic behavior control of the linear probe, making it easier to manufacture, more cost-effective, and offering a variety of material options.
Career Highlights
Chia-Ju Wei is associated with Mpi Corporation, where he continues to develop and refine his innovative ideas. His work has garnered attention for its practical applications and contributions to the industry.
Collaborations
Chia-Ju Wei has collaborated with notable coworkers, including Tzu-Yang Chen and Chin-Yi Lin, who have contributed to his projects and innovations.
Conclusion
Chia-Ju Wei's contributions to the field of technology through his patent for a linear probe demonstrate his innovative spirit and commitment to advancing engineering solutions. His work continues to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
