Chia-Hua Lu

Title: Chia-Hua Lu: Innovator in Chip Package Structures

Introduction

Chia-Hua Lu is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative chip package structures. His work has implications for the efficiency and performance of electronic devices.

Latest Patents

Chia-Hua Lu holds a patent for a chip package structure. This structure includes a chip package layer and at least one conductive structure layer. The chip package layer consists of at least one chip and an encapsulant that encapsulates the chip while exposing its upper surface. The conductive structure layer features a plurality of first conductive pillars and second conductive pillars. The arrangement of these pillars is designed to enhance the performance of the chip package, with a specific density ratio that optimizes functionality.

Career Highlights

Throughout his career, Chia-Hua Lu has worked with prominent organizations such as the Industrial Technology Research Institute and the Intellectual Property Innovation Corporation. His experience in these institutions has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Chia-Hua Lu has collaborated with notable colleagues, including Chen-Tsai Yang and Ko-Chin Yang. These partnerships have contributed to the advancement of research and development in the field of chip packaging.

Conclusion

Chia-Hua Lu's contributions to chip package structures demonstrate his innovative spirit and commitment to advancing technology in the semiconductor industry. His work continues to influence the design and efficiency of electronic devices.